Microsoft to spend $2.2bn on Malaysian cloud and AI tech
May 03, 2024
Microsoft is placing a big bet on Malaysia, with an ambitious investment plan to boost the country's digital infrastructure and employee skillset.
Lumotive launches 'revolutionary' optical beamforming chip
May 03, 2024
Lumotive has teamed up with SkyWater Technology to start production of LM10 – the first programmable optical metasurface that has been commercialised into a mass-producible chip.
NCAB: weak, but distinct, increase in order intake
May 02, 2024
Following the flat development over the past two quarter, NCAB noted a weak, but distinct, increase in order intake during the first quarter of 2024.
Samsung expands partnership with ZEISS to boost memory tech
April 29, 2024
Samsung Electronics and imaging specialist ZEISS Group have agreed to deepen their collaboration in a move to achieve better yields and performance in next-generation memory chips.
IBM plans $730m expansion of Canadian chip operation
April 29, 2024
IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant in Bromont, Quebec.
New Huawei phones feature SMIC's newest 7nm chips
April 26, 2024
Huawei’s latest Pura 70 series smartphones comprise an advanced made-in-China processor in defiance of US export curbs.
Samsung starts mass production of next-gen V-NAND
April 26, 2024
Samsung Electronics has started making 286-layer NAND flash memory chips, which expand bit density by 50% compared with 8th-generation V-NAND tech.
Micron: government grant will kickstart $50bn investment
April 26, 2024
US memory giant Micron has officially announced its USD 6.1 billion CHIPS and Science Act grant, and says the cash injection will support a huge CAPEX project to 2030.
Vsun Solar starts silicon wafer production in Vietnam
April 26, 2024
Japanese solar tech specialist Vsun Solar has officially opened its 4-gigawatt silicon wafer plant in Vietnam's northern province of Phu Tho.
Rohde & Schwarz opens new facility in India
April 23, 2024
On April 22, Rohde & Schwarz inaugurated a new facility centre in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services.
Infosys to acquire German automotive engineering firm
April 22, 2024
India's Infosys has reached an agreement to purchase in-tech, a provider of engineering R&D services to the automotive, rail and smart industry sectors.
Intel builds the world's most advanced EUV litho machine
April 19, 2024
Intel's newly-formed chip foundry business says it has successfully assembled the most advanced piece of semiconductor kit ever made: a High Numerical Aperture Extreme Ultraviolet lithography scanner.
Eindhoven University unveils Future Chips project
April 19, 2024
The Eindhoven University of Technology (TU/e) has announced a major new project to 'boost the position of the Netherlands and Europe in the global chip sector.'
Sponsored content by Multi Leiterplatten GmbH
PCBs: price reduction of up to -50.3% through AI
Thanks to the increased use of AI in production preparation, Multi-CB, a leading European PCB specialist, has been able to permanently reduce the prices for 1- and 2-layer PCBs. The price for a half Eurocard (80x100mm), for example, is now € 14.80 instead of € 29.80. Due to the process, the price reduction has the most significant effect on small quantities, although medium quantities are also benefiting.
Quanta Computer to build production facility in Germany
April 17, 2024
Taiwanese Quanta Computer has signed a deal with CTP, a European developer and manager of industrial properties, for a high-tech 22,500 square metre production facility at CTPark Jülich in the Brainergy Park Jülich in northwest Germany.
Exyte acquires Kinetics Group
April 16, 2024
Exyte says it plans to acquire Kinetics Group, a global provider of installation services, equipment, as well as technical facility management.
Kyocera AVX breaks ground on new facility
April 16, 2024
Kyocera AVX new 49,000-square-foot manufacturing and design center will allow the company to produce millions of precision timing and frequency control products.
Rapidus establishes subsidiary in Silicon Valley
April 15, 2024
Japanese chip manufacturer Rapidus is targeting the the lucrative US market by setting up a division in the backyard of some of the country's biggest tech firms.
Huawei to develop lithography tech at new R&D centre
April 12, 2024
Chinese tech giant Huawei is reported to be building a new research unit in Shanghai. It wants to develop chipmaking tools that could eventually rival those of ASML, Canon, and Nikon.
Samsung edges closer to first ever workers' strike
April 12, 2024
Members of Samsung Electronics’ largest labour union, NSEU, have voted overwhelming to support the first strike in the company’s history.
Averna acquires automated test solutions provider ELCOM
April 10, 2024
Averna, a test & quality solutions provider, announces the acquisition of ELCOM, a. s. and its subsidiaries. ELCOM is a player in test & measurement, power engineering and industrial automation.
Taiwan DRAM manufacturers gradually resume production
April 10, 2024
DRAM manufacturers are gradually resuming production following the earthquake that struck Taiwan on April 3, 2024. Despite some damages and the necessity for inspections or disposal of wafers among suppliers, TredForce reports that the impact on the total DRAM output for Q2 is estimated to be less than 1%
Has Samsung secured an advanced packaging deal with Nvidia?
April 09, 2024
Online reports say Samsung has sealed an advanced packaging order for NVIDIA’s AI processors.
TSMC names Kikuyo as the location of its second Japan fab
April 09, 2024
Taiwan Semiconductor Manufacturing Co has confirmed that it will build its second Japanse foundry in the same region as its first: at Kikuyo in the Kumamoto Prefecture.
Apple's new 'new' thing? A personal robot?
April 08, 2024
Speculation is rampant that Apple is working on a robot assistant that people can use in their homes.
Diamond-based semiconductor startup Diamfab raises EUR 8.7m
April 08, 2024
France-based Diamfab has completed a funding round to accelerate its research into diamond as a replacement for silicon.
Earthquake update: Taiwan's tech sector weathers the storm
April 04, 2024
Taiwan's wafer foundries and DRAM production remains unaffected following the earthquake that struck the island on April 3, 2024.
Its official: SK hynix to invest $3.87 billion in US plant
April 04, 2024
South Korean memory specialist SK hynix says that it will invest an estimated USD 3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Taiwan earthquake spares DRAM and foundry production
April 03, 2024
In the wake of a 7.2-magnitude earthquake off the eastern coast of Taiwan at 7:58 AM on April 3rd, TrendForce immediately investigated the damage and operational status of various manufacturers.
Infineon signs MoU with Korean shipbuilding firm
April 02, 2024
Germany's semiconductor group Infineon has agreed a partnership with HD Korea Shipbuilding & Offshore Engineering Co to develop energy-efficient semiconductor tech for electric-powered shipping.
AESC commits $1.5bn to expand its US EV battery plant
April 02, 2024
Japan-based battery tech company AESC will boost production its lithium-ion electric vehicle battery manufacturing operations at Florence County, South Carolina.
SEALSQ Corp will open an OSAT in the US next year
April 02, 2024
Post-quantum tech firm SEALSQ has revelled plans to create an Open Semiconductors Assembly and Test (OSAT) plant in the US, which will be operational by end of 2025.
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